德国Sentech 集成等离子刻蚀和沉积的多腔系统

高产量

等离子蚀刻和沉积腔体可以与多达两个片盒站组合，用于到200 mm晶片的高产量工艺。

研发

三到六个端口传送腔室可用于集成ICP等离子刻蚀机、RIE刻蚀机、原子层沉积系统、PECVD和ICPECVD沉积设备，以满足研发的要求。样品可以通过预真空室和/或真空片盒站加载。

SENTECH多腔系统包括等离子刻蚀和/或沉积腔体、传送腔室、预真空室或片盒站。传送腔室包括传送机械手臂，可适用于三至六个端口。可以使用多达两个片盒站来增加产量。传送腔室可以配备多种选择。

用于研发的SENTECH多腔系统通过图形用户界面控制软件操作。强大的控制软件可用于工业领域高产量的多腔系统。

高产量的多腔系统

ICP-RIE等离子刻蚀腔体可与两个片盒站组合用于200mm晶片的高产量并行工艺。

用于研发的多腔系统

ICP-RIE，RIE，PECVD和ICPECVD等腔体可与预真空室，片盒站等组合使用，以满足研发的特殊要求。

A multicavity system for integrated plasma etching ａnd deposition at Sentech, Germany

High yield

Plasma etching ａnd deposition cavities can be combined with up to two chip box stations for high yield processes to 200 mm wafers.

Research ａnd development

Three to six port transfer Chambers can be used to integrate ICP plasma etchers, RIE etchers, atomic-layer deposition systems, PECVD ａnd ICPECVD deposition equipment to meet the development requirements.Samples can be loaded through a pre-vacuum chamber and/or a vacuum cartridge station.

The SENTECH multicavity system includes plasma etching and/or deposition Chambers, transfer Chambers, prevacuum Chambers, or chip box stations.The transfer chamber includes a transfer robotic arm that can be used on three to six ports.Up to two chip box stations can be used to increase production.The transfer chamber can be equipped with a variety of options.

The SENTECH multicavity system for development controls software operations through a graphical user interface.Powerful control software can be used for high - yield multi - cavity systems in industry.